Advances in Embedded and Fan-Out Wafer Level Packaging Technologies By Beth Keser [et al] (9781119314134) IA

Text Registration

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies By Beth Keser [et al] (9781119314134) IA

Status

Published

on 28 Feb 2019

Year of Creation

2019

John Wiley and Sons, Inc

Registration Number

TX0008729098

on 28 Feb 2019

The U.S. Copyright record (Registration Number: TX0008729098) dated 28 Feb 2019, pertains to an electronic file (eService) titled "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies By Beth Keser [et al] (9781119314134) IA" created in 2019. The copyright holder is John Wiley and Sons, Inc, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to John Wiley and Sons, Inc.

John Wiley and Sons, Inc

Application Details

Registration Number

TX0008729098

Registration Date

2/28/2019

Year of Creation

2019

Agency Marc Code

DLC-CO

Record Status

New

Corporate Author

John Wiley and Sons, Inc

Physical Description

Book, 548 p

First Publication Nation

United States

ISBN

9781119314134

Preexisting Material

Some previously published text

Corporate Authors

Inc John Wiley and Sons

Notes

Material Matter Claimed Note: Compilation of individual contributions

Statements

Application Title Statement: Advances in Embedded and Fan-Out Wafer Level Packaging Technologies By Beth Keser [et al] (9781119314134) IA

Author Statement: John Wiley and Sons, Inc employer for hire Domicile: United States Authorship: Compilation of individual contributions

Notes

Material Matter Claimed Note: Compilation of individual contributions

Statements

Application Title Statement: Advances in Embedded and Fan-Out Wafer Level Packaging Technologies By Beth Keser [et al] (9781119314134) IA

Author Statement: John Wiley and Sons, Inc employer for hire Domicile: United States Authorship: Compilation of individual contributions

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