Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Text Registration

Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Status

Published

on 1 Feb 2021

Year of Creation

2020

The American Society of Mechanical Engineers

Registration Number

TX0008943349

on 1 Feb 2021

The U.S. Copyright record (Registration Number: TX0008943349) dated 1 Feb 2021, pertains to an electronic file (eService) titled "Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)" created in 2020. The copyright holder is The American Society of Mechanical Engineers, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to The American Society of Mechanical Engineers.

The American Society of Mechanical Engineers

Application Details

Registration Number

TX0008943349

Registration Date

2/1/2021

Year of Creation

2020

Agency Marc Code

DLC-CO

Record Status

New

Corporate Author

American Society of Mechanical Engineers

Physical Description

Electronic file (eService)

First Publication Nation

United States

Corporate Authors

American Society of Mechanical Engineers

Notes

Rights Note: Anthony Kibort, The American Society of Mechanical Engineers, ASME, 2 Park Ave, New York, NY, 10016-5990, United States, (212) 591-7052, kiborta@asme.org

Local Copyright Note: Basis for Registration: Collective work

Statements

Application Title Statement: Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Author Statement: The American Society of Mechanical Engineers employer for hire Domicile: United States Authorship: text

Notes

Rights Note: Anthony Kibort, The American Society of Mechanical Engineers, ASME, 2 Park Ave, New York, NY, 10016-5990, United States, (212) 591-7052, kiborta@asme.org

Local Copyright Note: Basis for Registration: Collective work

Statements

Application Title Statement: Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Author Statement: The American Society of Mechanical Engineers employer for hire Domicile: United States Authorship: text

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