Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]

Serial Registration

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]

Status

Published

on 1 Oct 2018

Year of Creation

2018

The Electrochemical Society

Registration Number

TX0008656624

on 1 Oct 2018

The U.S. Copyright record (Registration Number: TX0008656624) dated 1 Oct 2018, pertains to an electronic file (eService) titled "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]" created in 2018. The copyright holder is The Electrochemical Society, known for their creative contributions in serial registration. For any inquiries concerning this copyrighted material, kindly reach out to The Electrochemical Society.

The Electrochemical Society

Application Details

Registration Number

TX0008656624

Registration Date

10/1/2018

Year of Creation

2018

Agency Marc Code

DLC-CO

Record Status

New

Corporate Author

Electrochemical Society

First Publication Nation

United States

ISBN

978-1-60768-854-9

Corporate Authors

Electrochemical Society

Notes

Rights Note: Logan Streu, The Electrochemical Society, Inc., 65 S. Main Street, Building D, Pennington, NJ, 08534, (609) 737-1902 x116, logan.streu@electrochem.org

Copyright Local Holdings: vol. 86, no. 8, 2018 ISBN 978-1-60768-854-9 Created 2018 Pub. 2018-09-21 Reg. 2018-10-01 TX0008656624 HHEZ

Statements

Application Title Statement: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Author Statement: The Electrochemical Society employer for hire Domicile: United States Citizenship: United States Authorship: Collective Work Authorship and Component Work(s) authored or fully owned by the Collective Work Author

Notes

Rights Note: Logan Streu, The Electrochemical Society, Inc., 65 S. Main Street, Building D, Pennington, NJ, 08534, (609) 737-1902 x116, logan.streu@electrochem.org

Copyright Local Holdings: vol. 86, no. 8, 2018 ISBN 978-1-60768-854-9 Created 2018 Pub. 2018-09-21 Reg. 2018-10-01 TX0008656624 HHEZ

Statements

Application Title Statement: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

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