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Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]
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Copyright Title

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]

Status

Published

on 1 Oct 2018
Year of Creation
2018
Copyright Claimant
The Electrochemical Society
Registration Number
TX0008656624
on 1 Oct 2018

Copyright Summary


The U.S. Copyright record (Registration Number: TX0008656624) dated 1 Oct 2018, pertains to an electronic file (eService) titled "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB [Published: 2018-09-21. Issue: vol. 86, no. 8, 2018]" created in 2018. The copyright holder is The Electrochemical Society, known for their creative contributions in serial registration. For any inquiries concerning this copyrighted material, kindly reach out to The Electrochemical Society.

Copyright Details


Copyright Claimant
The Electrochemical Society

Application Details


Registration Number
TX0008656624
Registration Date
10/1/2018
Year of Creation
2018
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
Electrochemical Society
First Publication Nation
United States
ISBN
978-1-60768-854-9

Corporate Authors


Notes


Rights Note: Logan Streu, The Electrochemical Society, Inc., 65 S. Main Street, Building D, Pennington, NJ, 08534, (609) 737-1902 x116, logan.streu@electrochem.org
Copyright Local Holdings: vol. 86, no. 8, 2018 ISBN 978-1-60768-854-9 Created 2018 Pub. 2018-09-21 Reg. 2018-10-01 TX0008656624 HHEZ

Statements


Application Title Statement: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Author Statement: The Electrochemical Society employer for hire Domicile: United States Citizenship: United States Authorship: Collective Work Authorship and Component Work(s) authored or fully owned by the Collective Work Author
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